Programmable Unit Sizes

Isolation Design Flow for Zynq UltraScale+ MPSoCs and UltraScale+ FPGAs (XAPP1335)

Document ID
XAPP1335
Release Date
2023-05-15
Revision
2.2 English

It is important to include enough required programmable unit (PU) resources in a Pblock to support the assigned module. This is verified by reviewing the resources table when the Pblock is drawn. A Pblock can be of any shape; the shape is defined by the combination of PUs that are assigned to it.

The following table lists out the minimum fence size in terms of PU for the user tiles. For more details on Fence, refer to Isolation Fence.

Table 1. PU Unit Sizes
Tile User Tile Description Fence Size
SLICEL (CLBL) Configurable Logic Block. The key logic unit of an FPGA. Vertical: 1 PU

Horizontal: 1 PU

SLICEM (CLBM) Configurable Logic Block. The key logic unit of an FPGA. Vertical: 1 PU

Horizontal: 1 PU

DSP

Digital Signal Processor. A programmable math function (DSP tile is two DSP48E1 slices; analysis was done on DSP48E1 slice; AMD Vivado™ tools only allow selection of a DSP tile).

Vertical: 1 PU

Horizontal: 1 PU

BRAM Block RAM. User-accessible high speed RAM (BRAM tile is RAMB36 which is two RAMB18 blocks; Vivado tools only allow selection of a BRAM tile). Vertical: 1 PU

Horizontal: 1 PU

URAM High density block RAM. User-accessible high speed RAM Vertical: 1 PU

Horizontal: 1 PU

HDIO General purpose I/O block Vertical: 1/2 PU (12 IO)

Horizontal: 1/2 PU (12 IO)

HPIO High Performance I/O block Vertical: 1 PU (52 IO)

Horizontal: 1 PU (52 IO)

GTX/GTY QUAD High speed transceiver. The GTX or GTY Quad tile is made up of four channels. PR Units in different Pblocks are allowed to abut as long as one channel along the abutment is not used. Vertical: 1 PU

Horizontal: 1 PU PU GTX/Y Channel

PCI-E PCI Express® Endpoint Block Vertical: 1 PU

Horizontal: 1 PU

SYSMON System Monitor. Contains analog-to-digital converters (ACDs). Vertical: 1 PU

Horizontal: 1 PU

CMAC Centralized Media Access Control Block Vertical: 1 PU

Horizontal: 1 PU

INTERLAKEN High Speed Chip to Chip pack transfer port Vertical: 1 PU

Horizontal: 1 PU

  1. If a fence is needed between two adjacent HPIO banks, it should be an unused HPIO PU between them. This renders all of the I/Os of the fence HPIO bank to be unusable.