Review the following:
- Footprint compatibility
- Differences in XPIO, HDIO, and GTY transceiver counts
- Package dimensions, including height and overhang
- Additional power rail requirements
- XPIO performance differences
- XPIO fabric access limitations
- GTYP fabric access limitations
- I/O bank and GT Quad number differences
- GT_RCAL and GT_RREF pin differences
- Decoupling capacitor requirements
- Package pin flight time differences between devices