The high-level goal of package migration is to ensure that customers can use the same PCB across different devices in a footprint compatible package. Package migration places extra design complexity on the package layout because there are stringent migration design rules in place to ensure that migration is possible across devices in a given package. Most of the packages that are being offered support migration across devices within a given Versal portfolio. However, there are packages that span across device families offering migration support.
- VSVA2197 and VSVD1760: Supports migration across devices within the Versal AI Core and Prime series
- VFVF1760 and VFVC2197: Supports migration across devices within the Versal Prime and Premium series
The key high-level differences between the various Versal devices that impact PCB design from a package migration perspective are as follows:
Versal AI Core Series
- High compute series with medium density PL, connectivity capability coupled with AI and DSP acceleration engines
- AI Core devices offer only GTY/GTYP transceiver support
- Maximum GTY transceiver data rate is 32.75 Gb/s
- No GTM transceiver support
- Package type: Bare die, lidless
- Package overhang: Yes, for selected die/package combinations
- Die type: Monolithic
Versal Prime Series
- Mid range series with medium density PL, signal processing, and connectivity capability
- Prime devices offer a combination of GTY/GTYP (32.75 Gb/s) and GTM (58 Gb/s) transceiver support
- Package type: Lidded, lidless
- Package overhang: None
- Die type: Monolithic
Versal Premium Series
- Premium Series: Premium platform with maximum adaptable engines, 112G SerDes, and 600G Integrated IP
- Premium devices offer a combination of GTYP (32.75 Gb/s), GTM (58 Gb/s), and GTM (112 Gb/s) transceiver support along with PCIe Gen 5 support
- Package type: Lidded, lidless
- Package overhang: None
- Die type: Monolithic, SSI technology
In order to enable migration between any two devices in a given package, PCB designers should be aware of any differences that exist between devices upfront for a given package. This is necessary to ensure that the PCB layout can account for these differences during the board design phase and enable seamless migration. Refer to Versal Adaptive SoC Migration Checklist and the subsequent sections that explain each item in the checklist. Some of the items in the checklist might not be applicable for a given migration scenario. However, it would be helpful to go through the checklist to identify the differences that might be applicable for your specific implementation and ensure the PCB design accounts for the differences.