1.Review footprint compatibility, including banks that are bonded vs. unbonded.
2.Review I/O and transceiver Quad numbering and locations.
3.Review power supply differences across speed and temperature grades.
4.Review -3 speed grade migration.
5.Review video codec unit (VCU) migration.
6.Review graphics processing unit (GPU) migration.
7.Review decoupling capacitor requirements.
8.Review PCI Express® requirements and block locations.
9.Review integrated 100G Ethernet requirements and block locations.
10.Review Interlaken requirements and block locations.
11.Review power supply and thermal requirements.
12.Review pin flight time differences between devices.