RLDRAM 3 Memory Address and Command Fly-by Routing and Termination

UltraScale Architecture PCB Design User Guide (UG583)

Document ID
UG583
Release Date
2023-11-14
Revision
1.27 English

Using fly-by topology, each address and command signal is routed to drop by each memory device and connect to its corresponding pin. (This Figure).

Figure 2-63:      Address, Command, and Control Fly-by Termination for RLDRAM 3 Memories

X-Ref Target - Figure 2-63

ug583_c2_29.jpg

Table: RLDRAM 3 Memory Fly-by Impedance, Length, and Spacing Guidelines for Address, Command, and Control Signals shows the RLDRAM 3 memory fly-by impedance, length, and spacing guidelines for address, command, and control signals.

Table 2-74:      RLDRAM 3 Memory Fly-by Impedance, Length, and Spacing Guidelines for Address, Command, and Control Signals

Parameter

L0 (Device Breakout)

L1
(Main PCB)

L2 (DRAM Breakout)

L3

L4
(To RTT)

Units

Trace type

Stripline

Stripline

Stripline

Stripline

Stripline

Single-ended impedance Z0

50±10%

36±10%

50±10%

50±10%

39±10%

W

Trace width

4.0

7.0

4.0

4.0

6.0

mil

Trace length

0.0~0.8/1.2(1)

0.0~4.0

0.0~0.25

0.35~1.05

0~1.0

inches

Spacing in address, command, and control (minimum)

4.0

8.0

4.0

8.0

8.0

mil

Spacing to clock signals (minimum)

8.0

20

8.0

20

20

mil

Spacing to other group signals (minimum)

8.0

30

30

30

30

mil

Maximum PCB via count

6

Notes:

1.See item 2 in General Memory Routing Guidelines.