Table: Zynq UltraScale+ MPSoC Decoupling Capacitor Recommendations to Table: Zynq UltraScale+ MPSoC PS Decoupling Capacitor Recommendations (0.5 mm Pitch in UBVA494 and UBVA530 Devices) show the recommended decoupling capacitor quantities for Zynq UltraScale+ XC devices. Table: Zynq UltraScale+ MPSoC Decoupling Capacitor Recommendations (0.5 mm Pitch in UBVA494 and UBVA530 Devices) and Table: Zynq UltraScale+ MPSoC PS Decoupling Capacitor Recommendations (0.5 mm Pitch in UBVA494 and UBVA530 Devices) show the decoupling capacitor quantities for 0.5 mm pitch devices (UBVA494 and UBVA530 packages).
|
VCCINT/VCCINT_IO(1) |
VCCBRAM/VCCINT_IO(2) |
VCCAUX/VCCAUX_IO(3) |
HDIO/HPIO(4) (per bank) |
||||||
---|---|---|---|---|---|---|---|---|---|---|
330 µF |
100 µF |
47 µF |
10 µF |
47 µF |
10 µF |
47 µF |
10 µF |
47 µF |
10 µF |
|
CG Devices |
||||||||||
XCZU1CG-SBVA484 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU1CG-SFVA625 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU1CG-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU2CG-SBVA484 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU2CG-SFVA625 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU2CG-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU3CG-SBVA484 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU3CG-SFVA625 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU3CG-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU3TCG-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU3TCG-SFVD784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU4CG-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU4CG-FBVB900 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU5CG-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU5CG-FBVB900 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU6CG-FFVC900 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU6CG-FFVB1156 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU7CG-FBVB900 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU7CG-FFVC1156 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU7CG-FFVF1517 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU9CG-FFVC900 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU9CG-FFVB1156 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
EG Devices |
||||||||||
XCZU1EG-SBVA484 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU1EG-SFVA625 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU1EG-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU2EG-SBVA484 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU2EG-SFVA625 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU2EG-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU3EG-SBVA484 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU3EG-SFVA625 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU3EG-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU3TEG-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU3TEG-SFVD784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU4EG-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU4EG-FBVB900 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU5EG-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU5EG-FBVB900 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU6EG-FFVC900 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU6EG-FFVB1156 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU7EG-FBVB900 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU7EG-FFVC1156 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU7EG-FFVF1517 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU9EG-FFVC900 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU9EG-FFVB1156 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU11EG-FFVC1156 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU11EG-FFVB1517 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU11EG-FFVF1517 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU11EG-FFVC1760 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU15EG-FFVC900 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU15EG-FFVB1156 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU17EG-FFVB1517 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU17EG-FFVC1760 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU17EG-FFVD1760 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU17EG-FFVE1924 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU19EG-FFVB1517 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU19EG-FFVC1760 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU19EG-FFVD1760 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU19EG-FFVE1924 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
2 |
1 |
1 |
EV Devices |
||||||||||
XCZU4EV-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU4EV-FBVB900 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU5EV-SFVC784 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU5EV-FBVB900 |
1 |
4 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU7EV-FBVB900 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU7EV-FFVC1156 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU7EV-FFVF1517 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
RFSoC Devices |
||||||||||
See Table: Programmable Logic Rail Decoupling Guidelines for Zynq UltraScale+ RFSoCs to Table: DAC Decoupling Guidelines for Zynq UltraScale+ RFSoC XC Devices. |
||||||||||
Notes: 1.Connect VCCINT and VCCINT_IO together on the PCB for -3, -2, and -1 speed grades. The capacitors listed are the total number of capacitors for the combined rail. 2.Connect VCCBRAM and VCCINT_IO together on the PCB for -2L and -1L speed grades. The capacitors listed are the total number of capacitors for the combined rail. 3.VCCAUX and VCCAUX_IO must share the same plane on the PCB. The capacitors listed are the total number of capacitors for the combined rail. 4.The 47 µF capacitor can be combined at one per every four shared HDIO/HPIO banks. |
VCC_PSINTFP |
VCC_PSINTLP |
VCC_PSAUX |
VCC_PSPLL |
VCC_PSINTFP_DDR |
VCCO_PSIOx(1) (Each) |
VCC_PSBATT |
VCCO_PSDDR |
|||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
100 µF |
10 µF |
100 µF |
10 µF |
100 µF |
10 µF |
100 µF |
10 µF |
100 µF |
10 µF |
100 µF |
10 µF |
10 µF |
100 µF |
10 µF |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Notes: 1.The 100 µF capacitor can be combined at one per every four shared VCCO_PSIO banks. 2.For PS_MGTRAVCC and PS_MGTRAVTT use one 10 µF capacitor each. See PCB Guidelines for the PS Interface in the Zynq UltraScale+ MPSoC. |
|
VCCINT_VCU |
||||
---|---|---|---|---|---|
330 µF |
100 µF |
47 µF |
10 µF |
1.0 µF |
|
XCZU4EV-SFVC784 |
1 |
1 |
1 |
3 |
6 |
XCZU4EV-FBVB900 |
1 |
1 |
1 |
3 |
6 |
XCZU5EV-SFVC784 |
1 |
1 |
1 |
3 |
6 |
XCZU5EV-FBVB900 |
1 |
1 |
1 |
3 |
6 |
XCZU7EV-FBVB900 |
1 |
1 |
1 |
3 |
6 |
XCZU5EV-FFVC1156 |
1 |
1 |
1 |
3 |
6 |
VCCINT/VCCINT_IO (1) |
VCCBRAM/VCCINT_IO (2) |
VCCAUX/VCCAUX_IO (3) |
HDIO/HPIO (per bank) (4) |
||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
330 µF |
100 µF |
47 µF |
10 µF |
1.0 µF |
47 µF |
10 µF |
1.0 µF |
47 µF |
10 µF |
1.0 µF |
47 µF |
10 µF |
1.0 µF |
1 |
4 |
1 |
2 |
6 |
1 |
1 |
2 |
1 |
1 |
2 |
1 |
1 |
1 |
Notes: 1.Connect VCCINT and VCCINT_IO together on the PCB for all speed grades other than low power (L). The capacitors listed are for the total number of capacitors on the combined rail. 2.Connect VCCBRAM and VCCINT_IO together on the PCB for low power (L) speed grades. The capacitors listed are for the total number of capacitors on the combined rail. 3.VCCAUX and VCCAUX_IO must share the same plane on the PCB. The capacitors listed are for the total number of capacitors on the combined rail. 4.The 47 µF capacitor can be combined at one per every four shared HDIO/HPIO banks. |
VCC_PSINTFP |
VCC_PSINTLP |
VCC_PSAUX |
VCC_PSPLL |
VCC_PSINTFP_DDR |
VCCO_PSIOx (1) (Each) |
VCC_PSBATT |
VCCO_PSDDR |
||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
100 µF |
10 µF |
1.0 µF |
100 µF |
10 µF |
1.0 µF |
100 µF |
10 µF |
100 µF |
10 µF |
100 µF |
10 µF |
1.0 µF |
100 µF |
10 µF |
100 µF |
10 µF |
100 µF |
10 µF |
1.0 µF |
1 |
1 |
2 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Notes: 1.The 100 µF capacitor can be combined at one per every four shared VCCO_PSIO banks. 2.For PS_MGTRAVCC and PS_MGTRAVTT use one 10 µF capacitor each. See PCB Guidelines for the PS Interface in the Zynq UltraScale+ MPSoC. |
Table: Programmable Logic Rail Decoupling Guidelines for Zynq UltraScale+ RFSoCs shows the recommended decoupling capacitor quantities for core rails in Zynq UltraScale+ RFSoC XC devices.
RFSoC |
VCCINT/VCCBRAM/VCCINT_IO(1) |
VCCBRAM/VCCINT_IO(2) |
VCCAUX/VCCAUX_IO(3) |
VCCO (4) |
||||||
---|---|---|---|---|---|---|---|---|---|---|
330 µF |
100 µF |
47 µF |
10 µF |
47 µF |
10 µF |
47 µF |
10 µF |
47 µF |
10 µF |
|
XCZU21DR-FFVD1156 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU25DR-FFVE1156 XCZU25DR-FSVE1156 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU25DR-FFVG1517 XCZU25DR-FSVG1517 |
1 |
5 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU27DR-FFVE1156 XCZU27DR-FSVE1156 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU27DR-FFVG1517 XCZU27DR-FSVG1517 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU28DR-FFVE1156 XCZU28DR-FSVE1156 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU28DR-FFVG1517 XCZU28DR-FSVG1517 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU29DR-FFVF1760 XCZU29DR-FSVF1760 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU39DR-FFVF1760 XCZU39DR-FSVF1760 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU42DR-FFVE1156 XCZU42DR-FSVE1156 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU43DR-FFVE1156 XCZU43DR-FSVE1156 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU43DR-FFVG1517 XCVU43DR-FSVG1517 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU46DR-FFVH1760 XCZU46DR-FSVH1760 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU47DR-FFVE1156 XCZU47DR-FSVE1156 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU47DR-FFVG1517 XCZU47DR-FSVG1517 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU48DR-FFVE1156 XCZU48DR-FSVE1156 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU48DR-FFVG1517 XCZU48DR-FSVG1517 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU49DR-FFVF1760 XCZU49DR-FSVF1760 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU63DR-FFVE1156 XCZU63DR-FSVE1156 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU64DR-FFVE1156 XCZU64DR-FSVE1156 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU65DR-FFVE1156 XCZU65DR-FSVE1156 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
XCZU67DR-FFVE1156 XCZU67DR-FSVE1156 |
2 |
6 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Notes: 1.Connect VCCINT standalone, and VCCBRAM/VCCINT_IO together on the PCB for L speed grades. The capacitors listed are the total number of capacitors for the combined rail. 2.VCCAUX and VCCAUX_IO must share the same plane on the PCB. The capacitors listed are the total number of capacitors for the combined rail. 3.The 47 µF capacitor can be combined at one per every four shared HDIO/HPIO banks. 4.Capacitor specifications are the same as in Table: Recommended PCB Capacitor Specifications and Placement Guidelines for XC Devices. |
Table: VCCSDFEC Decoupling Guidelines for Zynq UltraScale+ RFSoC XC Devices shows the recommended decoupling capacitor quantities for Zynq UltraScale+ RFSoC XC devices that contain SD-FEC circuitry.
|
VCCSDFEC |
|||
---|---|---|---|---|
100 µF |
47 µF |
10 µF |
1.0 µF |
|
Devices with SD-FEC |
1 |
1 |
1 |
4 |
Notes: 1.Power assumption is 5W on VCCSDFEC. |
Table: VCCINT_AMS and ADC Decoupling Guidelines for Zynq UltraScale+ RFSoC XC Devices shows the recommended decoupling capacitor quantities for VCCINT_AMS, ADC_AVCC, and ADC_AVCCAUX in Zynq UltraScale+ RFSoC XC devices.
Table: DAC Decoupling Guidelines for Zynq UltraScale+ RFSoC XC Devices shows the recommended decoupling capacitor quantities for DAC_AVCC, DAC_AVCCAUX, and DAC_AVTT in Zynq UltraScale+ RFSoC XC devices.