Recommended Decoupling Capacitor Quantities for Kintex UltraScale Defense Grade (XQ) Devices

UltraScale Architecture PCB Design User Guide (UG583)

Document ID
UG583
Release Date
2023-11-14
Revision
1.27 English

Table: Decoupling Capacitor Recommendations for Kintex UltraScale XQ Devices show the recommended decoupling capacitor quantities for Kintex UltraScale defense grade (XQ) devices.

Table C-1:      Decoupling Capacitor Recommendations for Kintex UltraScale XQ Devices

 

VCCINT_IO or VCCINT/VCCINT_IO/VCCBRAM(1)

VCCBRAM/VCCINT_IO(2)

VCCAUX/VCCAUX_IO(3)

HRIO/HPIO(4) (per bank)

330 µF

47 µF

22 µF

2.2 µF

0.47 µF

0.1 µF

22 µF

2.2 µF

0.47 µF

22 µF

2.2 µF

0.47 µF

22 µF

2.2 µF

XQKU040-RBA676

2

3

5

10

12

8

1

1

1

1

1

1

1

1

XQKU040-RFA1156

2

3

5

10

12

8

1

1

1

1

1

1

1

1

XQKU060-RFA1156

2

3

7

13

19

26

1

1

1

1

1

1

1

1

XQKU095-RFA1156

2

3

6

13

19

25

1

1

1

1

1

1

1

1

XQKU115-RLD1517

3

6

11

22

42

82

1

1

1

1

1

1

1

1

XQKU115-RLF1924

3

6

11

22

42

82

1

1

1

1

1

1

1

1

Notes:

1.Applicable for standalone VCCINT or combined VCCINT/VCCINT_IO/VCCBRAM. The capacitors listed are the total number of capacitors for each scenario.

2.Combine VCCBRAM and VCCINT_IO when not at same voltage as VCCINT. The capacitors listed are the total number of capacitors for the combined rail.

3.VCCAUX and VCCAUX_IO must share the same plane on the PCB. The capacitors listed are the total number of capacitors for the combined rail.

4.The 22 µF capacitor can be combined at one per every four shared HRIO/HPIO banks.