VSRA2197 Mechanical—XQVC1902 and XQVM1802

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

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Figure 1. Package Dimensions for VSRA2197 (XQVC1902 and XQVM1802)

Important: The material used for the stiffener ring is stainless steel, which is electrically conductive and not connected to ground (GND) in the package. The stiffener ring should be externally connected to system ground to avoid collecting charges in space environments. If attaching a heat spreader on the stiffener ring, use an electrically conductive adhesive (such as silver-filled epoxy).