Component Pick-up Tool Consideration

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

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1.4 English

For pick and place machines to place lidless and bare-die flip-chip BGAs onto PCBs, AMD recommends using soft tips or suction cups for the nozzles. This prevents chipping, scratching, or even cracking of the bare die.

Figure 1. Recommended Method For Using Pick-up Tools