Flip-Chip Packages

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

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1.4 English

AMD Versal™ devices are offered in flip-chip BGA packages, which present a low-resistance thermal path. Packages primarily consist of lidless with stiffener ring variations, with the exception of the bare-die packages and lidded packages incorporating a heat spreader with an additional thermal interface material (TIM), as shown in the following figure.

Figure 1. Heat Spreader with Thermal Interface Material

Materials with high thermal conductivity and consistent process are expected to be used to deliver low thermal resistance to a heat sink, and are included in lidded packages with a heat spreader. An effort to ensure optimized package electrical return paths produces the added benefit of enhanced power and ground plane arrangement in the packages. A boost in copper density on the planes improves the overall thermal conductivity through the laminate. In addition, the extra dense and distributed via fields in the package increase the vertical thermal conductivity.