Push-Pin and Shoulder Screw Heat Sink Attachment Process with Phase Change Material (PCM) Application

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

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1.4 English
Prior to attaching the heat sink, the Versal device needs be surface mounted on the motherboard.
  1. Place the motherboard into a jig or a fixture to hold the motherboard steady to prevent any movement during the heat sink attachment process.
    Note: The jig or fixture needs to account for the push pin depth of the heat sink.
  2. PCM tape, cut to the size of the heat sink, is applied on the underside of the heat sink at a modest angle with the use of a squeegee rubber roller. Apply pressure to help reduce the possibility of air entrapment under the tape during application.
  3. Using the push-pin tool, heat sinks are applied over the packages ensuring a pin locking action with the PCB holes. The compression load from springs applies the appropriate mounting pressure required for proper thermal interface material performance.
    Note: Heat sinks must not tilt during installation. This process cannot be automated due to the mechanical locking action which requires manual handling. The PCB drill hole tolerances need to be close enough to eliminate any issues concerning the heat sink attachment.