Edge Bond Removal

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

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1.4 English

Edge bond material can be removed by heating to 170–180°C, and scraping using a stiff probe made of stable organic material such as a non-resinous wood or Teflon. Use a hot air blower on the edge bond area and slowly remove the edge bond adhesive from side to side. Do not use force to remove the edge bond adhesive. Excess adhesive on the PCB can be removed using a chisel-tip soldering iron, with sufficient precautions to limit damage to the PCB surface.