Measurement Debug

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

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1.4 English

When performing in-system thermal testing, to ensure accurate data and not incur damage to the device, do not place a thermocouple in between the device and the heat sink. On the extreme side, it might cause additional mechanical and/or thermal stress to the device, leading to damage. Even if damage does not occur, it often leads to a thicker and or uneven thermal interface material thickness, leading to a thermal performance difference from a system without a thermocouple. To obtain the device temperature, use the System Monitor as a non-invasive means to get accurate device measurements while debugging the system.