Heat Sink Attachments

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

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1.4 English

Heat sinks can be attached to the package in multiple ways. For heat to dissipate effectively, the advantages and disadvantages of each heat sink attachment method must be considered. Factors influencing the selection of the heat sink attachment method include the package type, contact area of the heat source, and the heat sink type.