Revision History

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

Document ID
Release Date
1.4 English

The following table shows the revision history for this document.

Section Revision Summary
9/28/2023 Version 1.4
  • Removed the XCVC1352
  • Removed the VSVC2021 package offering for the XCVP1002 and XCVP1052
  • Added the VP1902 in the VSVA6865 and VSVB6865 packages.
  • Replaced VFVH1760 with VSVH1760 where previously missed.
SelectIO Pin Definitions Updated the C4CIO_PAD description.
Power Pin Definitions Updated the RSVD pin descriptions and added RSVD_VCCINT_SENSE, RSVD_GND_SENSE, and RSVD_VCCINT_GT pins.
PMCMIO, LPDMIO, PMCDIO Pin Definitions Added Note 1.
Die Level Bank Numbering and Device Diagrams Added additional diagrams.
Bank Diagram by Package for VP1202 Added a note before figure Figure 2 and updated GTM Quad 206 to CG [LN] in the VSVA2785 package.
About ASCII Package Files Updated the XPIO/GTMPerf description.
ASCII Pinout Files Added Note 1 to the table.
Pin Maps Added additional diagrams. Updated the LSVA4737 Package—VH1542 Pin Map, LSVA4737 Package—VH1582 Pin Map, LSVA4737 Package—VH1742 Pin Map, and LSVA4737 Package—VH1782 Pin Map.
SFVA784 Package—VM1102 Pin Map Updated power pin legend for RSVD_VCCINT_SENSE and RSVD_GND_SENSE.
VSRA2197 Package—XQVM1502 Pin Map Added pin map.
Mechanical Drawings Added mechanical drawings.
VFVC1596 Mechanical—VM1302 and VM1402 Updated image.
NSVH1369 Mechanical—VM2202, VC2602, VC2802, VE2602, and VE2802 Updated image and added VM2202 support.
Stencil Added more examples and Figure 1, Figure 3, and Table 1.
Edge Bonding Implementation Updated Figure 1.
3/23/2023 Version 1.3
General updates
  • Added the VH1522, VH1542, VH1582, VH1742, and VH1782 devices.
  • Added the VSVA3697 and LSVA4737 packages.
  • Added the VM2302 and VM2902 bank diagram overviews.
SelectIO Pin Definitions Added the C4CCIO_PAD pin.
Power Pin Definitions Added the VCCINT_IO_HBM, VCC_HBM, and VCCAUX_HBM pins.
Pin Maps Added VFVF1760 pin maps.
Table 6 Removed die flatness and parallelism specifications for all lidless packages.
VSVA2785 Mechanical—VP1202 Replaced with correct image.
Stencil Updated to add both uniform and non-uniform stencil aperture design.
Edge Bonding Implementation Updated both edge-bonding adhesive placement parameters.
11/17/2022 Version 1.2
General updates Added VSVA5601 package. Removed the VSVC2197 package (VM2202, VM2502, VP1202). Changed VFVH1760 package to VSVH1760 for VC2602, VC2802, VE2602, VE2802.
Power Pin Definitions Added GND_SENSE and VCCINT_SENSE to the table.
PMCMIO, LPDMIO, PMCDIO Pin Definitions Added a note to the REF_CLK description.
Die Level Bank Numbering and Device Diagrams Added additional diagrams to this chapter.
VM1102 Bank Diagram Overview Revised diagrams including Bank Diagram by Package for VM1102.
About ASCII Package Files Added an Important note about schematic symbols.
Pin Maps Updated the section with additional pin maps.
Mechanical Drawings Added reference to the 3D CAD STEP models. Updated the section with additional drawings and replaced the LSVC4072 Mechanical—VP1802 figure.
Packing and Shipping Added values to the table and corrected the VSVB2197.
7/05/2022 Version 1.1
General Updates Significant data realignment throughout document
Replaced the SFVB625 package with the SFVA784 package for the VM1102 throughout
Added XQ devices
Die Level Bank Numbering and Device Diagrams Added bank diagrams for VC1352, VC1502, VC1702, VM1102, VM1302, VM1402, VM1502, VM2502, and VM2902
I/O Bank Footprint Compatibility between Packages Updated banks and added devices
Transceiver Footprint Compatibility Between Packages Updated and added devices to the tables in this section
ASCII Pinout Files Added links to the AMD Versal™ device package pinout files.
VSVD1760 Package—VM1802 Pin Map Updated image for clarity
Mechanical Drawings Updated the VIVA1596 Mechanical—VC1802 and VC1902, VFVC1760 Mechanical—VM1502 and VM1802, VSVA2197 Mechanical—VC1802, VC1902, and VM1802
Added A4 dimension and VSRD1760 designation to VSVD1760 Mechanical—VC1802, VC1902, and VM1802
Package Marking Added marking for XQ AMD Versal™ devices
Soldering Guidelines Updated jpj1554077106995.html#jpj1554077106995__note_import_rework
Stencil Updated Figure 2
Edge Bonding Implementation Updated table and images
Edge Bond Removal Updated discussion
Conformal Coating Moved section
Guidelines for Thermal Interface Materials Updated the recommendation and added a table
7/16/2020 Version 1.0
Initial release. N/A