Heat Sink Attachment Process Considerations

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

Document ID

AM013

Release Date

2024-07-02

Revision

1.5 English

After the component is placed onto the PCBs, when attaching a heat sink to the bare-die package, the factors in the following table must be carefully considered (as shown in the following figure).

Table 1. Heat Sink Attachment Considerations
Consideration(s)	Effect(s)	Recommendation(s)
In a heat sink attach process, what factors can cause damage to the exposed die and passive capacitors?	Uneven heat sink placement Uneven TIM thickness Uneven force applied when placing heat sink placement	Even heat sink placement Even TIM thickness Even force applied when placing heat sink placement
Does the heat sink tilt or tip the post attachment?	Uneven heat sink placement will damage the silicon and can cause field failures	Careful handling not to contact the heat sink with the post attachment Use a fixture to hold the heat sink in place with post attachment until it is glued to the silicon

Figure 1. Recommended Application of Heat Sink