Edge Bonding Guidelines

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

Document ID
Release Date
1.4 English

The edge bonding technique uses high-adhesion adhesives dispensed along the periphery of a component, as shown in the following figure. AMD recommends edge bonding for increased mechanical reliability in cases where the device is exposed to extensive temperature cycling or extreme shock and vibration, such as space, defense and telecommunications applications. Designers are expected to evaluate the need for edge bonding based on the requirements of the specific application being implemented.

Figure 1. Edge Bonded BGA Packages