Mechanical and Thermal Design Guidelines for Lidless Flip-chip Packages

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

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1.4 English

This section discusses the challenges of thermal management including reducing device thermal resistance and optimal power dissipation without an increase in junction temperature. The lidless Versal device packages target the largest devices while allowing for cooler operation temperatures (up to 10°C) with the same power dissipation. Precise mechanical design and component thermal management is vital for device and system performance. This document presents the unique thermal and mechanical design requirements for lidless devices.