Post Reflow/Cleaning/Washing

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

Document ID
Release Date
1.4 English

Many PCB assembly subcontractors use a no-clean process in which no post-assembly washing is required. Although a no-clean process is recommended, if cleaning is required, AMD recommends a water-soluble paste and a washer using a deionized-water. Baking after the water wash is recommended to prevent fluid accumulation. Cleaning solutions or solvents are not recommended because some solutions contain chemicals that can compromise the lid or stiffener adhesive, thermal compound, or components inside the package.