Package Parameter Guidelines

Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics (DS925)

Document ID

DS925

Release Date

2023-12-26

Revision

1.26 English

The parameters in this section provide the necessary values for calculating timing budgets for clock transmitter and receiver data-valid windows.

Table 1. Package Skew
Symbol	Description	Device	Package	Value	Units
PKGSKEW	Package Skew^{1, 2}	XCZU1	SBVA484	190	ps
			SFVA625	86	ps
			SFVC784	115	ps
			UBVA494	56	ps
		XCZU2	SBVA484	105	ps
			SFVA625	108	ps
			SFVC784	93	ps
			UBVA530	78	ps
		XCZU3	SBVA484	105	ps
			SFVA625	108	ps
			SFVC784	93	ps
			UBVA530	78	ps
		XCZU3T	SFVC784	70	ps
		XCZU3T	SFVD784	93	ps
		XCZU4	SFVC784	133	ps
		XCZU4	FBVB900	159	ps
		XCZU5	SFVC784	133	ps
		XCZU5	FBVB900	159	ps
		XCZU6	FFVC900	119	ps
		XCZU6	FFVB1156	134	ps
		XCZU7	FBVB900	141	ps
			FFVC1156	175	ps
			FFVF1517	305	ps
		XCZU9	FFVC900	119	ps
		XCZU9	FFVB1156	134	ps
		XCZU11	FFVC1156	170	ps
			FFVB1517	176	ps
			FFVF1517	186	ps
			FFVC1760	215	ps
		XCZU15	FFVC900	118	ps
		XCZU15	FFVB1156	132	ps
		XCZU17	FFVB1517	221	ps
			FFVC1760	226	ps
			FFVD1760	178	ps
			FFVE1924	174	ps
		XCZU19	FFVB1517	221	ps
			FFVC1760	226	ps
			FFVD1760	178	ps
			FFVE1924	174	ps
PKGSKEW	Package Skew^{1, 2}	XAZU1EG	SBVA484	190	ps
			SFVA625	86	ps
			SFVC784	115	ps
		XAZU2EG	SBVA484	105	ps
			SFVA625	108	ps
			SFVC784	93	ps
		XAZU3EG	SBVA484	105	ps
			SFVA625	108	ps
			SFVC784	93	ps
		XAZU3TEG	SFVC784	70	ps
		XAZU3TEG	SFVD784	93	ps
		XAZU4EV	SFVC784	133	ps
		XAZU5EV	SFVC784	133	ps
		XAZU7EV	FBVB900	141	ps
		XAZU11EG	FFVF1517	186	ps
		XQZU3EG	SFRA484	106	ps
		XQZU3EG	SFRC784	93	ps
		XQZU5EV	SFRC784	133	ps
		XQZU5EV	FFRB900	155	ps
		XQZU7EV	FFRB900	141	ps
		XQZU7EV	FFRC1156	176	ps
		XQZU9EG	FFRC900	119	ps
		XQZU9EG	FFRB1156	135	ps
		XQZU11EG	FFRC1156	170	ps
		XQZU11EG	FFRC1760	214	ps
		XQZU15EG	FFRC900	119	ps
		XQZU15EG	FFRB1156	127	ps
		XQZU19EG	FFRB1517	211	ps
		XQZU19EG	FFRC1760	228	ps
These values represent the worst-case skew between any two SelectIO resources in the package: shortest delay to longest delay from die pad to ball. Package delay information is available for these device/package combinations. This information can be used to deskew the package.