Packaging a Vitis Acceleration Platform - 2020.2 English

With all requirements prepared for Vitis acceleration platforms, you can package them together and generate the final Vitis acceleration platform. You can do this using either the Vitis IDE or the Xilinx Software Command-Line Tool (XSCT).

• In the Vitis IDE, select File > New > Platform Project to create a Vitis platform.
• Using XSCT, you can use the platform command to create a platform and the domain command to add domains into a platform. For more information about XSCT, refer to Xilinx Software Command-Line Tool in the Embedded Software Development flow of the Vitis Unified Software Platform Documentation (UG1416).

The platform is an encapsulation of multiple hardware and software components. This capsulation makes it easier to hand off deliveries from hardware-oriented engineers to application developers.

The following files and information are packaged into the platform.

Hardware Specification

This is an extensible XSA file.

Software Components

These are added to the platform as a Linux domain that enables OpenCL runtime.

Software components include the following:

• Boot components
  • BIF file that describes the boot components and their properties for Bootgen to generate the boot.bin file.
  • A boot components directory that includes all the files described in the BIF file.
• Image directory (optional): Contents in this directory will be copied into the FAT32 partition of the final SD card image.
• Linux domain: The platform requires a Linux domain. The kernel, RootFS, and sysroot info can be added when creating a platform, or when creating an application.
• Emulation support files (optional)

/* linux */
the_ROM_image:
{
  [fsbl_config] a53_x64
  [bootloader] <fsbl.elf>
  [pmufw_image] <pmufw.elf>
  [destination_device=pl] <bitstream>
  [destination_cpu=a53-0, exception_level=el-3, trustzone] <bl31.elf>
  [destination_cpu=a53-0, exception_level=el-2] <u-boot.elf>
}