Device Reliability Report (UG116)

Document ID
Release Date
10.17 English

AMD publishes this report to provide customers with insight regarding the reliability of AMD products. Reliability is defined as product performance to specification over time in response to varied (specified) environmental stress conditions. The goal of the reliability program is to achieve continuous improvement in the robustness of each product being evaluated.

As part of this program, finished product reliability is measured periodically to ensure that the product performance meets or exceeds reliability specifications. Reliability programs are executed in response to internal programs.

The reliability qualifications of new devices, wafer processes, and packages are designed to ensure that AMD products satisfy internal requirements before transfer into production. The reliability qualification and monitoring requirements are outlined in Table 1 through Table 1. The reliability stress tests are conducted according to the conditions specified in JEDEC Solid State Technology Association's reliability test methods for packaged devices, JESD22, except Group B and D tests in which it follows DSCC test methods, MIL-STD-883.

In this report, obsolete refers to AMD products for which a Product Discontinuation Notice (PDN) has been issued to cease the shipment and to data more than two years old that is no longer valid due to a process change.