| Package | Size | I/O | Pitch | Ball/ Column Size | Pad Opening | Pad Type | Die Size | Substrate |
|---|---|---|---|---|---|---|---|---|
| FGG676 | 27 x 27 | 676 | 1.00 | 0.60 | 0.46 | SMD | 17.8 x 17.8 x 0.3 | 0.56 thick, 4-layer |
| FFG1704 | 42.5 x 42.5 | 1,704 | 1.00 | 0.60 | 0.53 | SMD | 23 x 23 | 1.152 thick, 6-layer |
| FFG1152 | 35 x 35 | 1,152 | 1.00 | 0.60 | 0.53 | SMD | 22 x 20 x 0.7 | 1.152 thick, 6-layer |
| FBVA900 | 31 x 31 | 900 | 1.00 | 0.60 | 0.53 | SMD | 16.30 x 11.36 | 1.24 thick, 10-layer |
| FFVB2104 | 47.5 x 47.5 | 2104 | 1.00 | 0.6 | 0.53 | SMD | 18 x 22.5 | 1.42 thick, 14-layer |
| FLVA1924 | 45 x 45 | 1924 | 1.00 | 0.6 | 0.53 | SMD | 25 x 31 | 1.33 thick, 12-layer |
Mother Board Design and Assembly Details
- 8-layer, FR-4, 220 x 140 x 2.3622 mm size, OSP finish
- 0.5 mm pad diameter/0.65 mm solder mask opening (NSMD pads)
- Board layer structure: signal/GND/signal/power/signal/GND/signal/power
- Power, GND layer has 70% metal. Internal signal layer has 40% metal.
- 0.1524 mm laser cut stencil, 0.50 mm aperture, alpha metals WS609 paste
Test Condition
- FGG676: 0°C – 100°C, 40-minute thermal cycle, 10-minute dwells, 10°C/minute ramp rate
- FFG1152: 0°C – 100°C, 10-minute dwells, 5-minute ramps, 2 cycles/hour
Failure Criteria
- Continuous scanning of daisy chain nets (every 2 minutes)
- OPEN: Resistance of net > threshold resistance (300Ω)
- FAIL: At least 2 opens within one cycle, log 15 failures for each net
| Package | Cycles Completed | Number Tested | Number Failed | First Failure (Cycle) | Characteristic Life (Cycle) |
|---|---|---|---|---|---|
| FGG676 | 7,027 | 35 | 27 | 4,390 | 5,974 |
| FFG1704 | 5,000 | 32 | 0 | NA | NA |
| FFG1152 | 4,640 | 28 | 26 | 3,186 | 4,121 |
| FBVA900 | 8,737 | 32 | 28 | 7,181 | 8,260 |
| FFVB2104 | 8,568 | 32 | 14 | 5,205 | 9,351 |
| FLVA1924 | 4,605 | 32 | 25 | 2,759 | 4,222 |
Weibull Plots
Figure 1. Cycles to Failure in the Second-Level Reliability Tests for
FGG676
Figure 2. Cycles to Failure in the Second-Level Reliability Tests for
FFG1152
