| Package | Size | I/O | Pitch | Ball/ Column Size | Pad Opening | Pad Type | Die Size | Substrate |
|---|---|---|---|---|---|---|---|---|
| FLVA1924 | 45 x 45 | 1924 | 1.00 | 0.60 | 0.53 | SMD |
14.4 x 23 x 0.10 (2 pcs) 25 x 31 x 0.50 |
2.00 thick, 18-layer |
Mother Board Design and Assembly Details
- 28-layer, Megtron-6, 290 x 140 x 3.4 mm size, OSP finish
- 0.53 mm pad diameter/0.63 mm solder mask opening (NSMD pads)
- Board layer structure: 28 layer with simulated power, ground (70% metal), and signal (40% metal) layer
- 0.127 mm laser cut stencil, 0.530 mm aperture, Indium 8.9HF paste
Test Condition
- 0°C–100°C, 40-minute thermal cycle, 10-minute dwells, 10°C/minute ramp rate
Failure Criteria
- Continuous scanning of daisy chain nets with event detector
- FAIL: Resistance of net > threshold resistance (500Ω), 10 events (maximum), 1 μs duration (maximum)
| Package | Cycles Completed | Number Tested | Number Failed | First Failure (Cycle) | Characteristic Life (Cycle) |
|---|---|---|---|---|---|
| FLVA1924 | 4605 | 32 | 25 | 2759 | 4222 |
Weibull Plots
Figure 1. Cycles to Failure in the Second-Level Reliability Tests for
FLVA1924
