FBG900

Device Reliability Report (UG116)

Document ID
UG116
Release Date
2024-11-08
Revision
10.19 English
Table 1. Package Details (All Dimensions in mm)
Package Size I/O Pitch Ball/Column Size Pad Opening Pad Type Die Size Substrate
FBG900 31 X 31 900 1.00 0.60 0.53 SMD 12.93 x 16.91 0.95 thick, 8-layer

Mother Board Design and Assembly Details

  • 8-layer, FR-4, 220 x 140 x 2.36 mm size, ENIG finish
  • 0.45 mm pad diameter/0.55 mm solder mask opening (NSMD pads)
  • Board layer structure: signal/GND/signal/power/signal/GND/signal/power
  • Power, GND layer has 70% metal. Internal signal layer has 40% metal.
  • 0.127 mm laser cut stencil, 0.50 mm aperture, alpha metals WS820 paste

Test Condition

  • 0°C–100°C, 40-minute thermal cycle, 10-minute dwells, 10°C/minute ramp rate

Failure Criteria

  • Continuous scanning of daisy chain nets with event detection
  • FAIL: Resistance of net > threshold resistance (500Ω), 10 events (maximum), 1 μs duration (maximum)
Table 2. Summary of Test Results
Package Cycles Completed Number Tested Number Failed First Failure (Cycle) Characteristic Life (Cycle)
FBG900 10,085 32 18 5,674 9,148

Weibull Plots

Figure 1. Cycles to Failure in the Second-Level Reliability Tests for FBG900