Non-Hermetic and Hermetic Packages

Device Reliability Report (UG116)
Document ID
UG116
Release Date
2024-06-25
Revision
10.18 English

Moisture sensitivity and reflow temperature information can be found in Device Package User Guide (UG112).

The non-hermetic package/assembly qualification is outlined in the following table. However, for hermetic package qualification, a full group B and D test per MIL-STD-883, Test Methods, is required.

Table 1. Non-Hermetic Package/Assembly Qualification
Reliability Test Conditions Duration Lot Quantity Sample Size per Lot Acceptance Criteria
THB 1 or HAST 1 85°C, 85% RH, VDD 1,000 hours 3 25 0 failures
130°C, 85% RH, VDD 96 hours
110°C, 85% RH, VDD 264 hours
Temperature cycling 1, 2, 3, 4 –65°C to +150°C 500 cycles 3 25 0 failures
–55°C to +125°C 1,000 cycles
–40°C to +125°C 1,000 cycles
Autoclave 1 or temperature humidity unbiased 1 or UHAST 1 121°C, 100% RH 96 hours 3 25 0 failures
85°C, 85% RH 1,000 hours
130°C, 85% RH or 110°C, 85% RH 96 hours or 264 hours
High-Temperature Storage (HTS) TA=150°C 1,000 hours 3 25 0 failures
  1. Package preconditioning is performed prior to THB, HAST, temperature cycling, autoclave, TH, and UHAST tests.
  2. For plastic BGA packages: –55°C to +125°C and 1,000 cycles.
  3. For flip chip packages: –55°C to +125°C and 1,000 cycles or –40°C to +125°C and 1,000 cycles.
  4. For plastic QFP packages: –65°C to +150°C and 500 cycles or –55°C to +125°C and 1,000 cycles.

The qualification process for new devices is shown in the following table.

Table 2. Device Qualification
Reliability Test Conditions Lot Quantity Sample Size per Lot Target Criteria
ESD HBM 1 1 3 1,000V
ESD CDM 2 1 3 250V 3
Latch-up Current injection 1 3 ±100 mA
  1. HBM = Human Body Model.
  2. CDM = Charge Device Model.
  3. CDM level of 20 nm and below process node is specified per JEP157.