| Package | Size | I/O | Pitch | Ball/ Column Size | Pad Opening | Pad Type | Die Size | Substrate |
|---|---|---|---|---|---|---|---|---|
| SFVA784 | 23 x 23 | 784 | 0.8 | 0.50 | 0.40 | SMD | 16.3 x 11.36 | 1.33 thick, 12-layer |
| SBVA784 | 23 x 23 | 784 | 0.8 | 0.50 | 0.40 | SMD | 16.3 x 11.36 | 1.33 thick, 12-layer |
Mother Board Design and Assembly Details
- 28-layer, Megtron-6, 305 x 140 x 3.4 mm size, OSP finish
- 0.40 mm pad diameter/0.50 mm solder mask opening (NSMD pads)
- Power, GND layer has 70% metal. Internal signal layer has 40% metal.
- 0.127 mm laser cut stencil, 0.40 mm aperture, SAC305 solder paste.
Test Condition
- 0°C–100°C, 40-minute thermal cycle, 10-minute dwells, 10°C/minute ramp rate
Failure Criteria
- Continuous scanning of daisy chain nets with event detector
- FAIL: Resistance of net > threshold resistance (500Ω) and lasting greater than 1 μs, followed by >9 events within 10% of the cycles to initial failure.
| Package | Cycles Completed | Number Tested | Number Failed | First Failure (Cycle) | Characteristic Life (Cycle) |
|---|---|---|---|---|---|
| SFVA784 | 6800 | 32 | 25 | 5049 | 6540 |
| SBVA784 | 6140 | 32 | 25 | 4120 | 5718 |
Weibull Plots
Figure 1. Cycles to Failure in the Second-Level Reliability Tests for
SFVA784
Figure 2. Cycles to Failure in the Second-Level Reliability Tests for
SBVA784
