The RF data converter clocking includes primary on-board reference PLL (LMK04208) and on-board RF PLLs (LMX2594) to generate RF-ADC and RF-DAC sample clocks. With careful board modification, external equipment can also directly drive ADC bank clocks and DAC bank clocks through the Samtec LPAF (8x40) connector.
The LMX2594 clocks can be configured either as direct RF clocks or as reference clock sources for the internal PLL contained within the RFSoC data converter tile.
See ZCU111 System Controller Tutorial (XTP517) [Ref 11] for information on programming the LMK and LMX PLLs.
Two Samtec LPAF (8x40) connectors provide an RFMC system interface for plug-in cards. This Figure and This Figure illustrate the connector pinout and plug-in card dimensions.
This Figure shows the bank view of the ZCU111 RF clocking structure.
Table: RFMC External Clocking Modifications and Table: SYSREF External Clocking Modifications provides guidance on external clocking modifications.
IMPORTANT: To provide external sources from the RFMC connector, the default capacitors must be carefully moved to optional capacitor locations.
By default, the LMK04208 provides a clock to the DAC bank 228 SYSREF clock input pins.
IMPORTANT: To provide an external SYSREF clock with the onboard optional SMAs, the default capacitors must be carefully moved to optional capacitor locations.
Before making ZCU111 RF clock capacitor modifications, refer to the PC board layout and identify the metal RF cage associated with the capacitors of interest:
• C632/C640, C646/C718: RFCAGE2
• C683/C690, C692/C699: REFCAGE3
• C666/C673, C675/C682: RFCAGE4
• C742 and C743: RFCAGE1
The appropriate cage lid must be removed to make the capacitor modifications, and replaced upon completion.
To implement the external clock source capability, remove (desolder) the default capacitors and solder them onto the pads at the optional external source capacitors locations shown in the above tables (e.g., for Table: RFMC External Clocking Modifications , U102 Channel A, remove C632 and solder it at C948, remove C640 and solder it at C949, and so on). Due to via-in-pad component footprints, AMD recommends the rework be implemented by an expert rework technician.
The I2C_to_SPI bridge connectivity for PLL readback is shown in This Figure .