Steps to Designing a Thermal System

Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)

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  1. Identify the package lid type and associated documentation.
  2. Determine the contact area for the package and height requirements.
  3. Design the heatsink base.
  4. Design fins and airflow (or fluid flow if liquid cooling).
  5. Design the proper attachment.
  6. Choose thermal interface material (TIM) and determine application.
    1. TIM is the substance used between the device and thermal stack up, and is intended to improve thermal contact.
  7. Determine thermal parameters for simulation and validate thermal solution.
  8. Determine proper assembly, test, and debug (if necessary).