Stamped Flip Chip Lid

Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)

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Stamped flip chip lids are identified as a trapezoidal profile that is flat above the die surface and tapers towards the package substrate body edges. The heatsink surface generally only touches the flat surface at the top of the package. The following figure shows the cross section and top view of a stamped lid, also known as a type II lid.

Figure 1. Cross Section and Top View of a Stamped Lid