Choosing and Determining Package Lid Type

Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)

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1.0 English

Xilinx offers different packaging types for different devices, and each have benefits and trade-offs. It is important to understand what lid type is offered for the target device during both the selection and the design process. Some devices offer different types of lids, so it is important to both select the proper lid type for the system goals, and to know that the lid type could dictate a different thermal design strategy.