Managing Transient Pressure

Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)

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During the attachment of the thermal solution, short durations of higher pressure can be applied to the device as the force from the attachment increases and so as the TIM material compresses. When left unmanaged, it is possible the amount of pressure, even for a short time, can cause damage to the device.

One such method to do so is using proper installation equipment that can control the torque asserted on the screw attachments as to not exert excessive pressure on the device. An example tool is a smart torque screwdriver that can adjust angle, speed, and torque. This reduces stress to the device during assembly and allows the proper pressure profile to be applied to the device. This then allows safe assembly of the thermal system.