The package description and all mechanical specifications/dimensions can be found in publicly available packaging and pinouts documents. These documents are organized by device family, so after a family member is known, this document should be downloaded to understand the details of the packages available for the selected device. Below you will find links to each of these documents:
- 7 Series FPGAs Packaging and Pinout Product Specification (UG475). See the 7 Series FPGAs Package Specifications table to understand the package type and body size. Consult the Mechanical Drawings chapter for precise dimensions for all packages for these devices. The Thermal Specifications chapter provides additional thermal information for these packages.
- Zynq-7000 SoC Packaging and Pinout Product Specifications (UG865). See the Zynq-7000 SoC Package Specifications table to understand the package type and body size. Consult the Mechanical Drawings chapter for precise dimensions for all packages for these devices. The Thermal Specifications chapter provides additional thermal information for these packages.
- UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification (UG575). See the Package Specifications table to understand the package type and body size. Consult the Mechanical Drawings chapter for precise dimensions for all packages for these devices. The Thermal Specifications and Thermal Management Strategy chapters provide additional thermal information for these packages.
- Zynq UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG1075). See the Package Specifications table to understand the package type and body size. Consult the Mechanical Drawings chapter for precise dimensions for all packages for these devices. The Thermal Specifications and Thermal Management Strategy chapters provide additional thermal information for these packages.
- Versal ACAP Packaging and Pinouts Architecture Manual (AM013). See the Package Specifications table to understand the package type and body size. Consult the Mechanical Drawings chapter for precise dimensions for all packages for these devices. For additional information on thermal packages, see the Thermal Specifications and Thermal Management Strategy chapters.
- Kria K26 SOM Thermal Design Guide (UG1090). This guide covers many details of thermal design specific for Kria SOMs. It is suggested to read this entire document for Kria SOM thermal design. The K26 SOM Thermal Specifications table shows thermal targets and the Recommended Contact Area and 7X Thermocouple Locations on Top Heat Spreader for Characterization and Debug figure shows recommended contact area.