Kria SOM

Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)

Document ID
Release Date
1.0 English

Because the Kria devices have a heat spreader, consult the appropriate thermal design guide to find the recommended contact area. Mounting is done directly to the M3 mounting holes and thus there are no specific height tolerances to adhere to.

Figure 1. Recommended Contact Area for K26 SOM