Creating a Thermal Test Design - Creating a Thermal Test Design - XAPP1377

Designing Thermal Solutions for AMD Embedded Devices (XAPP1377)

Document ID
XAPP1377
Release Date
2025-06-27
Revision
2.0 English

The power within a programmable device is variable depending on use, so upfront consideration should be given to using the device for thermal testing and characterization. It is best to use the final device programming image for overall thermal characterization, as it most accurately represents the power in the product. However, this is not always possible, as the board is often designed and completed prior to the final image. The programmable nature of the FPGA allows for the creation of a power-consuming design specifically for thermal testing if a more accurate image is unavailable. Such a design is generally non-functional but dissipates power to desired levels for testing. Several methods exist to design such a test image. If such a test image is necessary, it is suggested to request it from AMD. Specific considerations require understanding based on the target device.