Kria SOM with Heat Spreader

Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)

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The Xilinx Kria™ system on a module (SOM) is a product containing multiple devices on a miniature printed circuit board (PCB) centering on a Xilinx device surrounded by other active and passive components. The SOM greatly simplifies design by including memory, voltage regulation, and other chip-level design requirements into a single, pre-designed module. Since the SOM consists of multiple chips, there are multiple points of cooling needed on a SOM. Xilinx simplifies this by including a pre-assembled heat spreader to the SOM. This means that the only requirement is to attach a heatsink (if necessary) to the heat spreader to control the temperature of the SOM.

Figure 1. Kria SOM with Pre-Assembled Heat Spreader