These documents provide supplemental material useful with this guide:
- Xilinx Power Efficiency
- 7 Series FPGAs Packaging and Pinout Product Specification (UG475)
- Zynq-7000 SoC Packaging and Pinout Product Specifications (UG865)
- UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification (UG575)
- Zynq UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG1075)
- Versal ACAP Packaging and Pinouts Architecture Manual (AM013)
- Kria K26 SOM Thermal Design Guide (UG1090)
- Thermal Models Download
- XPE Download
- XPE for Thermal Analysis Video
- PDM for SOM Download