Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)

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1.0 English

These documents provide supplemental material useful with this guide:

  1. Xilinx Power Efficiency
  2. 7 Series FPGAs Packaging and Pinout Product Specification (UG475)
  3. Zynq-7000 SoC Packaging and Pinout Product Specifications (UG865)
  4. UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification (UG575)
  5. Zynq UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG1075)
  6. Versal ACAP Packaging and Pinouts Architecture Manual (AM013)
  7. Kria K26 SOM Thermal Design Guide (UG1090)
  8. Thermal Models Download
  9. XPE Download
  10. XPE for Thermal Analysis Video
  11. PDM for SOM Download