Bare Die Lidless

Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)

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As the name implies, these have exposed die sitting on top of a package substrate without a lid or stiffener ring. This packaging option is generally found on smaller package body devices. It is found to be both cost effective and have very good thermal performance. This is a good choice for thermally demanding small-device applications. The following figure shows the cross section and top view of a bare die lidless package.

Figure 1. Bare Die Lidless Package