Measuring Heatsink Pressure

Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)

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Use of a pressure sensor or gauge placed in between the thermal system and the device is a prudent method to measure and fine tune both transient and steady-state pressure applied to the device. This should only be used early in the prototyping stages, but not during operation. This will adjust and refine the assembly process to ensure transient pressure does not exceed the maximum 50 PSI exerted on the device. Further, it will ensure that the final steady-state pressure is even and within device pressure targets after the settling of the TIM and any pressure compensating features of the attachment.