Sizing and Designing the Heatsink

Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)

Document ID
XAPP1377
Release Date
2022-06-06
Revision
1.0 English

Most solutions have unique sizing requirements both to properly interface the thermal solution to the device, and to fit into the overall system or chassis. Because of this, upfront design work must be done to ensure proper fitting. This section discusses how to properly size the heatsink to the device and share some considerations for sizing it to the system.