Use this format to export the XPE environmental, thermal and budget information in the
form of Xilinx design constrains (*.xdc) file
using the set_operating_condition commands. The exported file can be
sourced in Vivado project to get the same design constraints as set
in XPE. This file will have the following information in the exported
*.xdc file:
- Device Process
- Junction Temperature
- Ambient Temperature
- Airflow
- Heat sink
- Board and board layers
- Voltage
- Design Power Budget
Note:
*.xdc export feature is available only for UltraScale+ XPE spreadsheet.