HBM in Summary Sheet - 2020.2 English

Xilinx Power Estimator User Guide (UG440)

Document ID
Release Date
2020.2 English

Virtex UltraScale+ HBM total on-chip power is partitioned into two separate totals: one for the FPGA portion and another for the HBM Stack portion. The reason for this partition is that each portion has its own junction temperature. When targeting a device with HBM, this information appears in an additional summary located to the right side of the main summary sheet as shown in the following figure.

Figure 1. HBM in Summary Sheet

The summary contains the division between FPGA and HBM Stack for both On-Chip Power and Junction Temperature. The HBM Stack On-Chip Power is the HBM Static power (reported in the On-Chip Power table) and the HBM Dynamic power (the HBM portion of dynamic power shown on the HBM sheet). There is also the Override HBM Junction Temperature option, which works similar to the override option for the device. When you select this checkbox, the junction temperature can be entered in the box and it will be used to calculate the new HBM On-Chip Power. While it is possible to override only the HBM Junction Temperature, the HBM junction temperature is forced to be overridden if the device junction temperature is overridden in the Environment section.

The On-Chip Power table displays the totals for HBM Dynamic and Static power. The Dynamic power reported in the table is the same total reported on the HBM sheet which includes FPGA dedicated interface logic. The Power Supply table shows the current per HBM rail as shown in the following figure.

Figure 2. Power Supply Table