Xilinx®
Versal®
architecture,
UltraScale™
architecture, 7 series, and 6 series devices come in a variety of packages that are
designed for maximum performance and maximum flexibility. Four pitch sizes are available
for these packages: 1.0 mm, 0.92 mm, 0.8 mm, and 0.5 mm. In general, as the pitch size
decreases, the challenges for PCB routing increase as there is less room to route traces
and vias between package balls. This guide illustrates various methods for successful
design regardless of pitch size.
Note:
Throughout
this guide, various specifications and estimates are given regarding PCB
pricing, costs, and technology. As PCB manufacturing technology is constantly
advancing, it is highly advised to consult with your PCB manufacturer to fully
understand their capabilities regarding the information presented
here.