Recommended Design Rules and Strategies for BGA Devices User Guide (UG1099)

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2.0 English
Xilinx® Versal® architecture, UltraScale™ architecture, 7 series, and 6 series devices come in a variety of packages that are designed for maximum performance and maximum flexibility. Four pitch sizes are available for these packages: 1.0 mm, 0.92 mm, 0.8 mm, and 0.5 mm. In general, as the pitch size decreases, the challenges for PCB routing increase as there is less room to route traces and vias between package balls. This guide illustrates various methods for successful design regardless of pitch size.
Note: Throughout this guide, various specifications and estimates are given regarding PCB pricing, costs, and technology. As PCB manufacturing technology is constantly advancing, it is highly advised to consult with your PCB manufacturer to fully understand their capabilities regarding the information presented here.