The objective of this document to provide thermal design guidelines for designers of Kria™ K26 SOM based products. The goal is to ensure that the temperature of all components in a system are maintained within their functional temperature range. Within this temperature range, a component is expected to meet its specified performance and lifetime. Operation outside the functional temperature range can degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limit of a component can result in irreversible changes in the operating characteristics of the component.
In a system-level environment, the Zynq® UltraScale+™ MPSoC temperature is a function of both the system and the individual component thermal characteristics. The system-level thermal constraints consist of the local ambient air temperature and airflow over the Zynq UltraScale+ MPSoC as well as the physical constraints at and above the Zynq UltraScale+ MPSoC. The Zynq UltraScale+ MPSoC temperature depends upon the on-board component power dissipation, the Zynq UltraScale+ MPSoC package thermal characteristics, and the system cooling solution.
All these parameters are affected by the increase in Zynq UltraScale+ MPSoC performance levels and packaging density (more transistors). With an increase in operating frequencies and decrease in package sizes, the power density increases while the thermal solution space and airflow typically become more constrained or remain the same. The system design becomes more important to ensure that thermal design requirements are met for each component including the Zynq UltraScale+ MPSoC in the system.