Modeling in Detail

Kria K26 SOM Thermal Design Guide (UG1090)

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1.0 English

To help reduce the computation time to solve and model the K26 SOM in your system, a technical treatment is implemented as follows.

  • For the K26 MPSoC, a DELPHI thermal model is used in the K26 SOM thermal compact model.
  • Two resistance models were used for the components.
  • A lumping model is used to represent the four DDRs.
  • These individual models have their own TIM, metal islands combined, and resistance re-characterized to the desired precision and accuracy.
  • SOM Icepak models have I-grade or C-grade component temperature limits applied. As Flotherm has no such temperature limitation feature in the tool, Flotherm users need to look up on-board component temperature, which cannot exceed its maximum specification according to I-grade or C-grade rating.
  • Dissipation values should be applied according to their targeted system performances as reported by the PDM (see Power Estimation).
  • Numerical model boundary conditions are system parameters such as the operating ambient temperature, airflow, and pressure drop. In some cases the system platform altitude affect also needs to be considered and simulated.
  • Cooling simulation results should address design margins due to sensor accuracy, the character tolerances of the thermal interface material, mechanical manufacturing variations from fans, fins, heat pipe or vapor chamber soldering, and the heat sink base contact surface flatness.