Kria K26 SOM Thermal Design Guide (UG1090)

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The K26 SOM is available in the commercial and industrial temperature grades. The K26C SOM and K26I SOM support different temperature ranges.

Table 1. K26 SOM Thermal Specifications
K26 SOM Operating Temperature
K26C SOM 0°C to 85°C
K26I SOM –40°C to 100°C
Heat spreader plate (HSP-00075-01) C grade 70°C maximum
I grade 85°C maximum
Tip: The K26 is a production qualified SOM. For evaluation, the KV260 Starter Kit is available but is not intended for deployment. See Versal AI Core Series Data Sheet: DC and AC Switching Characteristics (DS957).

The K26 SOM is supplied with an aluminum heat spreader (HS). This heat spreader makes full contact with all the high-power active components, including the Zynq UltraScale+ MPSoC, DDR4 memory, eMMC, power management integrated circuit (PMIC), and power regulators. The primary function of the heat spreader is to transfer the non-uniform heat distribution of the module that is generated on the PCB assembly to the heat spreader, making the heat flux more uniform and spread over a larger surface area. This allows for more efficient heat transfer out of the package to an attached cooling device. The user-defined system cooling solutions should be designed to directly attach to the heat spreader.

Figure 1. K26 SOM

The heat spreader has four M3 mounting holes on the corners to attach the appropriate thermal solution for your system. Further details are available in the Kria SOM Carrier Card Design Guide (UG1091). Your system thermal solution must provide adequate cooling to maintain all the components on the PCB, including the K26 SOM, below the maximum temperature specifications as detailed in Table 1.