Package Bill of Material Change for Spartan-3AN Wire Bond Package (XCN17001) - Xilinx material supplier Nitto will discontinue supply of specific die attach film in March 2017 due to its raw material’s supplier ending business. Xilinx has successfully qualified Hitachi’s new die attach film in mass production for past 3 years without any quality or reliability issue. This change is aligning the die attach film to industry best practice and enables supply continuity for commercial and industrial “XC” Spartan-3AN products in wire bond packages. This change will not affect fit, form, function, reliability or MSL rating of the packages.