Cross-ship of Lead-free Bump Substrates in Lead-free (FFG/FBG/SBG) Packages (XCN16022) - To announce that selected Xilinx lead-free flip chip products denoted by the package code “FFG”, “FBG”, or “SBG” will be shipped with either the current eutectic C4 bump and associated substrate or the new lead-free C4 bump and associated lead-free substrate. The external packaging and the current lead-free balls will not be changed. Form, fit, function and reliability will remain the same.