Forged to Stamped Lid Conversion for Monolithic FPGA Flip Chip Packages (XCN16004) - To announce the transition from “forged” to “stamped” lids for selected monolithic flip chip packages of body sizes 35mm and below. Device-packages from Virtex®-4, Virtex®-7, Kintex®-7 FPGAs and Zynq®-7000 families will be included in the change. Lid material remains unchanged, as does fit and function. However, form (lid shape) will be slightly modified.