Flip Chip Bumping Factory Qualification at SPIL for Defense-grade 7 Series XQ FPGA Products (XCN16003) - To communicate that Xilinx has qualified SPIL Bumping for 7 Series FPGAs Defense-grade “XQ” flip chip products. - XCN16003

xcn16003.pdf

Document ID
XCN16003
Release Date
2016-06-27
Revision
1.0 English