Flip Chip Bumping Factory Qualification at SPIL for Defense-grade 7 Series XQ FPGA Products (XCN16003) - To communicate that Xilinx has qualified SPIL Bumping for 7 Series FPGAs Defense-grade “XQ” flip chip products. - XCN16003
xcn16003.pdf
- Document ID
- XCN16003
- Release Date
- 2016-06-27
- Revision
- 1.0 English